Hallo,
....you can try a photoresist.


----- Original Message -----
From: "Rob Hardman" 
To: 
Sent: Monday, July 08, 2002 8:02 PM
Subject: [mems-talk] RE:Protecting MEMS devices after etching


> -----Original Message-----
> From: Derek Strembicke [mailto:strem@ieee.org]
> Sent: Thursday, July 04, 2002 2:48 AM
> To: mems-talk@memsnet.org
> Subject: [mems-talk] Protecting MEMS devices after etching
>
>
> "Hi all,
>
> What methods do people use for protecting MEMS structures after etching
> and before dicing.......................
>
>
> Any thoughts or insights
>
>
> Derek Strembicke
> Principal MEMS/VLSI Design Engineer
> Stremco Research
> P.O. Box 2185
> Huntsville, Al, 35804-2185
>
> ph: (256) 653-3423
> email: strem@ieee.org"
>
>
> Hi Derek,
>
> In the optical industry, it is common to use a protective coating such
> as Shipley's FSC or MicroChem's MX 6C to protect devices during dicing.
> These products are essentially photoresists without photoactive
> compounds and can be removed with any common photoresist stripper
> (Shipley recommends their Remover 1165 MicroChem recommends Remover PG,
> both are NMP based removers). Since these products are made of the same
> novolac resins as photoresists their processing and final physical
> attributes will be the same but, since they are incapable of producing
> an image, the cost is reduced. Further the Shipley materials add a blue
> die for optical inspection. The one drawback on these items is that they
> are designed for thin films. The Shipley FSC-L spins on at 1.8 microns
> at 3000 rpm and the FSC-M reaches 3.3 microns at 3000 rpm. MicroChem's
> MX 6C 3.0 will yield 3 microns at 3500 rpm and the MX 6C 5.0 is a five
> micron version of the same product. These do not contain a dye. Please
> feel free to contact me if you have any further questions.
>
>
> Very Best Regards,
> Rob Hardman
> 617-965-5511 ext.313
> rhardman@microchem.com
>
> www.microchem.com
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