Hello Everyone,

I recently tried to apply a SAM to my surface micromachined structures following
the recipe found in the literature.  Specifically, I used the recipe from
"Alkyltrichlorosilane-Based Self-Assembled Monolayer Films for Stiction
Reduction in Silicon Micromachines," JMEMS, v7, n2, pp252.

However, I don't believe the SAM formation took place.  When the chips were
removed from the final rinse, they did not dewet.

I'd like to know what problems other people have had in reproducing this
procedure.  Are there additional conditions that need to be met for success?

Because of the known reproducibility problems of the ODTS process, we are
considering moving to the Alkene process outlined in "Alkene based monolayer
films as anti-stiction coatings for polysilicon MEMS," S&A:A, v91, pp239.  What
experiences have people had with this process?

Thanks in advance,

----------------------------------------
Robert Johnstone
Simon Fraser University
http://www.sfu.ca/~rjohnsto/