Dear all:
I want to make some metallic pattern(Ti/Au-40nm) by E-beam lithography and
sputtering.
My experiment requires some flat electrodes about 100nm(width).
E-beam evaporating with carbon crucible is not suitable to this purpose.
(You can see the AFM image at http://phya.snu.ac.kr/~lsjun/111.jpg)
Is it safe to deposit metals by sputtering in the lifeoff of PMMA?
Thanks in advance.

Sungjun Lee
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Mr. Sungjun Lee
Center for Science in Nanometer Scale,
Inter-University Semiconductor Research Center,
Seoul National University,
Seoul, 151-742, South Korea
Mobile:+82-16-2264658
Fax:+82-2-8748926
Mail:poyntor@yahoo.com
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