>Hello,

I have a fab process where I need to pattern a thin aluminum layer that has
been deposited on copper.  Unfortunately, the aluminum etch I have is PAE,
which also etches copper.  Any suggestions other than Cl2 RIE?  The
aluminum layer is used as a mask for a later processing step and could be
changed to another metal.

Sincerely,

Robert Dean

Research Associate IV
Center for Advanced Vehicle Electronics
Auburn University
200 Broun Hall
Auburn, AL 36849

Voice: 334-844-1838
Fax:   334-844-1898
Email: rdean@eng.auburn.edu
Web: http://www.eng.auburn.edu/~rdean/index.htm