If I understand correctly, you want to use AL as
the hard mask. If you, I used Ti on Cu as the hard
mask and HF dip can quickly remove Ti with almost
no etching on Cu.

Good Luck!
Bert

--- Robert Dean  wrote:
> >Hello,
>
> I have a fab process where I need to pattern a thin
> aluminum layer that has
> been deposited on copper.  Unfortunately, the
> aluminum etch I have is PAE,
> which also etches copper.  Any suggestions other
> than Cl2 RIE?  The
> aluminum layer is used as a mask for a later
> processing step and could be
> changed to another metal.
>
> Sincerely,
>
> Robert Dean
>
> Research Associate IV
> Center for Advanced Vehicle Electronics
> Auburn University
> 200 Broun Hall
> Auburn, AL 36849
>
> Voice: 334-844-1838
> Fax:   334-844-1898
> Email: rdean@eng.auburn.edu
> Web: http://www.eng.auburn.edu/~rdean/index.htm
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