In the book "Biosensors: Microelectrochemical Devices"
by Lambrechts and Sansen, they do a nice explanation
of Ag adhesion using different metal seed layers.

They report corrosion of a silver electrode using a Cr
seed layer after 46 hours. Thyey also tried Ti as an
adhesion layer, but found the best solution was to use
a two metal seed layer of Ti/Pd that can be deposited
by e-beam evaporation.

Jeff

--- "Thomas B. Jones"  wrote:
> Dear MEMS community:
>
> Is it true that Ag exhibits poor adhesion to Si, say
> for example, in
> comparison to Al?  Will a thin layer of Cr help to
> improve this adhesion?
> Finally, are there other straightforward methods to
> promote adhesion of
> these materials?
>
> Thanks.
>
> Tom Jones
>
>
>
________________________________________________________
> Thomas B. Jones
> Professor of Electrical Engineering
> University of Rochester
> P.O. Box 270126
> Rochester, NY  14627-0126    (USA)
> phone: 1-585-275-5233   fax: 1-585-273-4919
> email: jones@ece.rochester.edu
> http://www.ece.rochester.edu/~jones
>
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