Dear MEMS community,

   I'm now doing some mechanical property testing of silicon dioxide film in
MEMS device and my experiment requires a deposited SiO2 film with TENSILE
residual stress.
   But my school doesn't have a PECVD equipment right now. So I checked the
MEM-EXCHANGE to see if they could find a fab which has this capability and
experience. But unfortunately they told me that they couldn't find any fab
which can deposit PECVD SiO2 film with tensile residual stress, all of them are
compressive.

   Is there anyone know any fab or company has this capability or had this
experience before? Thank you very much for any info.!!!

-Nan Jing
Department of Materials Science and Engineering
CWRU