Hi MEMS-people,

I'm looking for an ICP processing service for 4 inch (500 um thick)
Si wafers, etching depth from 50 to 400 um, minimum feature size
about 50 um, amount of wafers: 5-10. Fast processing time appreciated.
Please contact me as soon as possible.

Regards,
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Joachim Oberhammer, Dipl.-Ing.

Royal Institute of Technology (KTH)   Phone:    +46/(0)8 790 6250
Dep. of Signals, Sensors and Systems  Fax:      +46/(0)8 10 0858
Microsystem Technology (MST)          Mobile:   +46/(0)70 692 1858
                                       e-mail:   joachim.oberhammer@s3.kth.se
Osquldas vdg 10                       homepage: http://www.s3.kth.se/mst/
SE-100 44 Stockholm, Sweden