Dear Tao,
There are a few choices for dispensing and point of use filtration for all the
resist products you mentioned but the I foresee the problem one being the
SU-8, due to the higher viscosity needed to create the thick films....I do
know that a number of facilities have had success with CYBOR pumps which are
capable of viscosities up to 44000 cPs and PTFE filters...The filtration level
for SU-8 is dependent upon the viscosity and is in the range 0.2 - 10
microns...
With respect to the other photoresists the standard pumps, Millipore or CYBOR,
should be adequate as they are more 'standard' resists and representatives of
the respective company would be able to recommend the correct systems....
If the resist residue in the case of SU-8 has not been exposed then regular
organic solvents, including Acetone, will work fine....For exposed/cured SU-8
this is a little more difficult, although we have had success with Hot Remover
PG, which is an NMP based stripper, at around 60-80C....For the other resists
Acetone should work well and in the case of PMMA there is a specific stripper
that works very effectively on all acrylic type products and is called Acryl
Strip...
If there are any more questions please contact me ...
Mark Shaw
Technical Sales & Applications Support
MicroChem Corp.
email: mshaw@microchem.com
url: www.microchem.com
-----Original Message-----
From: mems-talk-request@memsnet.org
[mailto:mems-talk-request@memsnet.org]
Sent: Monday, August 05, 2002 12:00 PM
To: mems-talk@memsnet.org
Subject: MEMS-talk digest, Vol 1 #366 - 9 msgs
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Today's Topics:
1. Resist filter and cleaning solutions (Tao Wang)
2. RE: SPR-220 spin coating problem (Greg Miller)
3. RE: SPR-220 spin coating problem (Bill Moffat)
4. RE: Ultrasonic Vs. Megasonic clean (Mark West)
5. about the Thomson effect (Jun Yao)
6. Problem for SU8 molding (Bo He)
7. photoresist AZ1518 (Li, Yun (Research))
8. AZ P49063 (LSWANG)
9. Information on Au metal line on silicon substrate (Ken Kwon)
--__--__--
Message: 1
From: "Tao Wang"
To: mems-talk@memsnet.org
Date: Thu, 1 Aug 2002 15:44:54 -0500
Subject: [mems-talk] Resist filter and cleaning solutions
Reply-To: mems-talk@memsnet.org
Hi MEMS guys,
I got two questions:
1. Is there any small pump or filter, say like a syringe, to filter resist
right before applying it? Are there successful stories in filtering SU8,
SPR and PMMA?
2. Is there any commercially available solution to clean the residues of
the above-mentioned resists that stick to glassware? I am looking for
long-lasting solutions other than simple organic solvents like acetone.
Any feedback is highly appreciated!
Tao
--__--__--
Message: 2
Subject: RE: [mems-talk] SPR-220 spin coating problem
Date: Thu, 1 Aug 2002 17:27:38 -0400
From: "Greg Miller"
To:
Reply-To: mems-talk@memsnet.org
Mahesh -
This website has fairly good processing procedure for SPR220-7.0 -
http://www-snf.stanford.edu/Process/Lithography/SPR220.html
I use this as a guideline modified it alittle to optimize my process.
Thanks,
Greg Miller
KVH Industries
Email: gmiller@kvh.com
-----Original Message-----
From: Mahesh Pitchumani [mailto:mp@creol.ucf.edu]
Sent: Thursday, August 01, 2002 1:35 PM
To: mems-talk@memsnet.org
Subject: [mems-talk] SPR-220 spin coating problem
Hi,
I am trying to spin coat SPR-220-7 thick resist from MicroChem with an
objective of getting 10-40 micron thick layers. I tried the process
supplied
by the company but it seems to give an uneven coat. Could anybody
suggest some
recipes for coating 10-40 micron thick layers with SPR_220.
I Thank you in advance for your help.
Mahesh Pitchumani
School of Optics/CREOL,
University of Central Florida.
4000 Central Florida Blvd,
Orlando, FL 32816-2700
Ph : 407-823-6827
Fax : 407-823-6880
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Hosted by the MEMS Exchange, providers of MEMS processing services.
Visit us at http://www.memsnet.org/
--__--__--
Message: 3
Subject: RE: [mems-talk] SPR-220 spin coating problem
Date: Thu, 1 Aug 2002 15:36:06 -0700
From: "Bill Moffat"
To:
Reply-To: mems-talk@memsnet.org
Mahesh,
Have you tried extrusion. In our baking of thick photo resists and
polymides we keep finding references to Fast Technologies who extrude polymer
coatings. apparently not to good for thin layers it gets better as the
thickness increases. At 40 microns thick it gives great uniformity. Best
contact I have is glenn Dickey 214 553 9991. hope this helps. Bill Moffat
-----Original Message-----
From: Mahesh Pitchumani [mailto:mp@creol.ucf.edu]
Sent: Thursday, August 01, 2002 11:35 AM
To: mems-talk@memsnet.org
Subject: [mems-talk] SPR-220 spin coating problem
Hi,
I am trying to spin coat SPR-220-7 thick resist from MicroChem with an
objective of getting 10-40 micron thick layers. I tried the process supplied
by the company but it seems to give an uneven coat. Could anybody suggest
some
recipes for coating 10-40 micron thick layers with SPR_220.
I Thank you in advance for your help.
Mahesh Pitchumani
School of Optics/CREOL,
University of Central Florida.
4000 Central Florida Blvd,
Orlando, FL 32816-2700
Ph : 407-823-6827
Fax : 407-823-6880
_______________________________________________
MEMS-talk@memsnet.org mailing list: to unsubscribe or change your list
options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk
Hosted by the MEMS Exchange, providers of MEMS processing services.
Visit us at http://www.memsnet.org/
--__--__--
Message: 4
From: "Mark West"
To:
Subject: RE: [mems-talk] Ultrasonic Vs. Megasonic clean
Date: Sun, 4 Aug 2002 23:49:06 -0700
Reply-To: mems-talk@memsnet.org
The main difference between the two cleaning mechanisms is cavitation. In
ultrasonics (<100Khz), cavitation occurs at relatively low power, is
omni-directional, and is strong enough to cause damage, which is why they
are not typically used with Silicon.
Megasonics (800-1000Khz) create micro-cavitation which also releases very
high energy, but the bubble size is so much smaller that the chances of
damage are not as great. There are also several types of acoustic streaming
that occur in Megasonics which help reduce the boundary layer at the
substrate surface and enhance chemical cleaning.
If you are looking at Megasonics, expect to pay roughly 10x the cost of
Ultrasonics. They are much more difficult to build and the Electronics are
much more sophisticated. There are varying methods of coupling the sound
energy from the transducers and this makes a significant difference in
cleaning effectiveness.
I work for a company that manufactures Megasonic Systems. If you are
interested in discussing your application, feel free to send me an email
offboard.
Mark West
mwest@imtecacculine.com
-----Original Message-----
From: mems-talk-admin@memsnet.org [mailto:mems-talk-admin@memsnet.org]On
Behalf Of Piao, Fan
Sent: Tuesday, July 30, 2002 3:08 PM
To: 'mems-talk@memsnet.org'
Subject: [mems-talk] Ultrasonic Vs. Megasonic clean
Can someone help me understand the difference between ultrasonic and
megasonic
clean mechanisms? Why do we generally need to use megasonic clean in Si
process
instead of ultrasonic clean?
Thanks,
Fan Piao
_______________________________________________
MEMS-talk@memsnet.org mailing list: to unsubscribe or change your list
options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk
Hosted by the MEMS Exchange, providers of MEMS processing services.
Visit us at http://www.memsnet.org/
--__--__--
Message: 5
From: "Jun Yao"
To:
Date: Mon, 5 Aug 2002 11:44:52 +0100
Subject: [mems-talk] about the Thomson effect
Reply-To: mems-talk@memsnet.org
Dear all,
Does anybody know Thomson effect ( not Joule-Thomson effect) ? How can I find
the Thomson coefficient for different materials and what is the SI unit of
Thomson coefficient?
The important thing is that whether there is a formulation for Thomson
effect?
Thank you very much.
Jun
--__--__--
Message: 6
From: "Bo He"
To: mems-talk@memsnet.org
Date: Thu, 01 Aug 2002 22:34:42 -0500
Subject: [mems-talk] Problem for SU8 molding
Reply-To: mems-talk@memsnet.org
Dear MEMS experts:
I got a big problem recently when developing SU8 mold. I am
using SU8-2025 to make 50um thick structures, which are many square
holes(25x25um, spacing 25um). But I cannot get my structures becasue the
developing takes too long. My developing procedure is as follows: After
developing for 10 minutes with strong agitation (underdeveloped), I put
the wafer in the developer for about 4 hrs with a stirer rotating.
Still underdeveloped but looks better. It seems that the developer cannot
get into the holes. I am not sure how long it will take to fully develop
the structure but it's not a good idea to just increase the developing
time. Does any people have the experience before? Is there any method
that can enhance the developing? Please give me some suggestions. Your
help is highly appreciated.
Bo
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--__--__--
Message: 7
From: "Li, Yun (Research)"
To: "'mems-talk@memsnet.org'"
Date: Fri, 2 Aug 2002 14:43:17 -0400
Subject: [mems-talk] photoresist AZ1518
Reply-To: mems-talk@memsnet.org
Hi, everyone,
I am working with AZ1518 on flat panel display. Could anyone give me some
suggestion what kind of
hard bake temperature I should use? I just want to bake 1.6 um resist hard
enough to resist wet
etching.
Thanks.
Yun Li
KWB405, Thin Films Lab
Micro and Nano Structures
One Research Circle, Niskayuna, NY 12309
GE Global Research Center
--__--__--
Message: 8
Date: Fri, 2 Aug 2002 13:06:50 -0700 (PDT)
From: LSWANG
To: mems-talk@memsnet.org
Subject: [mems-talk] AZ P49063
Reply-To: mems-talk@memsnet.org
Hi:
Does anybody has ever used AZ P4903 photoresist to
spin 50 um thick film. Can you recommend the process
to me?
Best
Lisen Wang
Yahoo! Health - Feel better, live better
http://health.yahoo.com
--__--__--
Message: 9
From: "Ken Kwon"
To: mems-talk@memsnet.org
Date: Sat, 03 Aug 2002 00:42:33 -0700
Subject: [mems-talk] Information on Au metal line on silicon substrate
Reply-To: mems-talk@memsnet.org
Hi, I am trying to use gold metal lines on p+ and n+ silicon surface. I am
in split decision between using TiW/TiW-N or Ti/Ti-N for underlying
diffusion barrier/adhesion layer. Could someone tell me what's advantage of
using particular diffusion barrier/adhesion layer for gold metallization?
Reference books or articles are also appreciated.
Thank you
Ken
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