Dear Muhammad,

If it is adhesion problem of gold pad onto polyimide : roughening polyimide
surface with O2 plasma or an adhesion layer deposition before gold
deposition may help.

Oray Orkun Cellek
o.o.cellek@ieee.org
Middle East Technical University
Electrical&Electronics Engineering Department
Ankara
Turkey

----- Original Message -----
From: "aslam muhammad" 
To: 
Sent: Thursday, August 15, 2002 9:23 PM
Subject: [mems-talk] wire bonding problem on polyimide


> Dear All
>
> I am depositing gold on a polyimide circuit to
> wirebond to a package but bond pad is not connected
> (reason may be that ultrsonic energy is transferred to
> polyimide surface)and there is no contact.  I don't
> know.  Can u Please help me in solving this problem or
> suggesting to make some other arrangement to connect
> the circuit on polyimide to some external package.
>
> Thanks
>
> M. Aslam
> m_aslammalik@hotmail.com
> HotJobs - Search Thousands of New Jobs
> http://www.hotjobs.com
> _______________________________________________
> MEMS-talk@memsnet.org mailing list: to unsubscribe or change your list
> options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk
> Hosted by the MEMS Exchange, providers of MEMS processing services.
> Visit us at http://www.memsnet.org/