MEMS members,

     I am interested in locating  groups that provide processing
services for 4" silicon wafers.  Currently, I need RIE,
TEOS, and electrostatic bonding processes performed on
4" silicon wafers.  The processes do not necessarily need to
be provided by the same organization.

     This is an urgent request.  Your support will be very
much appreciated.

                  Sincerely,

                  John