> Does anyone have some experience doing Si-Si bonding with
> LPCVD nitride
> & anneal process?
> Normally we know we can do the fusion bonding by oxide layer, but how
> about nitride?
> If we want to do this process, can we do the LPCVD nitride on both
> wafers?
> Please tell me where to find the reference.
>

It has been done.
The key is very smooth surfaces, with less than about 5 A (0.5 nm) roughness.
See the paper
M. Wiegand et al., "Wafer bonding of silicon wafers covered with various
surface layers," Sensors and Actuators, vol. 86, 2000, pp. 91-95.

        --Kirt Williams Agilent Technologies