Hi,
I am trying to get a through-hole in a Si wafer. I would like to know how
to perform alignment for the front and back side of a wafer. I have not
been able to align the two squares on either side of the wafer accurately.
Any suggestion regarding this will be really helpful.
Any suggestion for forming a through-hole without having to make two
squares on either side of the wafer will also be helpful.
Thanks

Kousik Sivakumar
Graduate student
Department of ECE
University of Delaware
Home: 302-737-5232
E-mail: sivakuma@mail.eecis.udel.edu