Rob,
You don't need to modify your saw. Get a resinoid or sinter blade which
require a special mounting flange. You can order a flange for as much as
exposed blade as required. I have cut 3mm substrates this way.
you can get blades & a flange from Microswiss (they are a part of K&S) or
other blade maanufacturers. You might want to consult them regarding the
blade type, diamond size, blade & cutting speed to fit your substrate.

Shay

RobDavis wrote:

> Want to modify K&E wafer saw to cut thicker wafer, bonded material.  Any
> clue how thick the substrate can be?  Can I take the cut up to the
> reinforcement ring for the blade?  Any ideas on diamond blade cost and
> supplier?
> Thanks
> Rob
>
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