Hi All,

I'm interested to know if there is anybody having information about
wafer level Au-Au thermocompression bonding i.e. bonding of e.g. two
silicon wafers with an Au interface. It seems to be quite widely used
for flip-chip bonding of single chips but for wafer level bonding it
seems hard to find any information.

Is there anybody having experience in this that can tell me some
approximate parameters for the process e.g. needed teperature and
pressure on the bond chuck etc. I would also appreciate any references
about this.

Thanks in advance,

/Martin