Hi,
        I've read a paper where borofloat glass was anodically bonded
to an Si wafer with 1200 V at 450 C, I used 15N of force for
total area of about 1/3 of a 3 inch wafer. The glass cracks, I tried 3
times. Does anyone have any suggestions about a better protocol? I've
assumed the CTE is the same as Pyrex, which is true for the average
CTE from 20-300C, but I haven't seen the data at 450 C.

Thanks,

Ziggy

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(Ziggy) Zigurts K. Majumdar
Department of Physics
Laboratory for Fluorescence Dynamics
University of Illinois at Urbana Champaign
1110 West Green St.
Urbana, IL 61801
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