The CTE for both products ( assuming you are comparing the Borofloat to the Pyrex 7740) are the same at 3.25 x 10-6/K (0 to 300 degree C) From what I am aware - 450 is well within the maximum operating temperature of Borofloat-which is listed for long term use at 450c and short term at 500c. Maybe you have some other stresses or even a thermal shock is present that are the cause of the cracking. Regards, Ken Smith Kmbh Associates 47 Rocket Circle Rancho Cordova, CA 95742 U S A 510-714-5055 Efax- 510 217 4421 or 561 658 6136 High Purity Float Zone and Specialty CZ Silicon for Power, IR and Mirror Optics, Optoelectronics, MEMS, SOI, and other Semiconductor applications. Service in SOI, Polishing SSP and DSP. Quartz, Glass, Pyrex and Borofloat Wafer Supply. Anodic Bonding. SOG, SOS. Zigurts Majumdar wrote: > Hi, > I've read a paper where borofloat glass was anodically bonded > to an Si wafer with 1200 V at 450 C, I used 15N of force for > total area of about 1/3 of a 3 inch wafer. The glass cracks, I tried 3 > times. Does anyone have any suggestions about a better protocol? I've > assumed the CTE is the same as Pyrex, which is true for the average > CTE from 20-300C, but I haven't seen the data at 450 C. > > Thanks, > > Ziggy > > ******************** > (Ziggy) Zigurts K. Majumdar > Department of Physics > Laboratory for Fluorescence Dynamics > University of Illinois at Urbana Champaign > 1110 West Green St. > Urbana, IL 61801 > ******************** > > > > > _______________________________________________ > MEMS-talk@memsnet.org mailing list: to unsubscribe or change your list > options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk > Hosted by the MEMS Exchange, providers of MEMS processing services. > Visit us at http://www.memsnet.org/ > > --