I would like to bond Si and pyrex wafer together by anodic bonding.  My Si wafer
has some trenches which the bottom is covered by a 200A Cr/ 500A Au.  How can I
clean this Si wafer before anodic bonding?  Can I do RCA SC1 clean
(water+H2O2+Ammonia solution) to remove organic contaminations, without the RCA
SC2 clean (water+H2O2+HCl), which remove the metallic contaminations?

Thank you very much for your help!

Phyllis

UC Davis



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