hello everybody,

I know this is an old problem but I could not find the answer to my
question.
I am trying to deposit a gold layer on nitride. The gold runs on the nitride
down to the substrate. The process does not allow the use of an adhesion
layer.
After sintering, the gold is seriously damaged (bumps, cracks, burns).
My question is: The finger that goes down on the substrate is also damaged.
What happens when sintering to affect the gold that is not on nitride? I am
just trying to understand the phenomenon.
Thanks in advance.

Rozenn KERAVEC



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