Hi,

Learning from papers, to ease the process of peeling off PDMS, we should
  expose the master, silicon wafer with pattern on its upper side, by
alkyltrichlorosilane or RIE the master with trifluoromethane, before
spining on PDMS. Is there any more convenient method to achieve the same
effect, i.e., to reduce the adhesion between Si surface and PDMS?

Thanks! Your opinion is highly appreciated!

Sincerely,

Ken-Chao, RA of IAM of NTU in Taiwan