Dear MEMS colleague:

  I would like to use photoresist as sacrifical layer with required thickness
around 0.2-0.3 um in my fabrication process.  However, typical AZ5214 positive
photoresist usually gives 1.5 ~ 1.6 um thickness at 3000 rpm spinning or down to
1 um thickness at 7000 rpm spinning.  I would like to ask if anyone has the
experience to thin out the AZ5214 photoresist with 0.2 - 0.3 um thickness and I
would be grateful if anyone can suggest me a solution.

  Thank you very much in advance.

Best Regards,
  Tak Sing

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Victor T.S. WONG
The Chinese University of Hong Kong
Email: assayer@ieee.org