Dear all,

On a silicon wafer where a Cu seed layer is sputtered, I am depositing
photoresist (8um thick) to create patterns and then electroplating  NiFe
through the patterns (5um thick).

The deposit has an even thickness except at the edges where there is a
big overplating. (kind of
"dog hears")

Does anyone have an idea on how to get rid of this edge problem?

Thanks a lot in advance,

Magali
--
PEI Technologies,
NMRC, Lee Maltings, University College,
Cork, Ireland.

Tel: +353 21 4 904279
Fax: +353 21 4 270271
email: mbrunet@nmrc.ie