Magali,

I would recommend injecting some negative pulses into your plating current. You
will have to do some experimenting to see what the amplitude and frequency
should be, however, that should work.

Regards,
Mike Mattes
Medtronic, Inc.

>>> mbrunet@nmrc.ucc.ie 10/17/02 12:58AM >>>
Dear all,

On a silicon wafer where a Cu seed layer is sputtered, I am depositing
photoresist (8um thick) to create patterns and then electroplating  NiFe
through the patterns (5um thick).

The deposit has an even thickness except at the edges where there is a
big overplating. (kind of
"dog hears")

Does anyone have an idea on how to get rid of this edge problem?

Thanks a lot in advance,

Magali
--
PEI Technologies,
NMRC, Lee Maltings, University College,
Cork, Ireland.

Tel: +353 21 4 904279
Fax: +353 21 4 270271
email: mbrunet@nmrc.ie



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