Hello! Share your ideas with other colleagues at the only conference in Europe for scientists, engineers and researchers to push current trends in Microsystems Metrology. Don't miss the chance to be in on discussions taking place to shape the future of this important field! Submit an abstract to the SPIE's conference on Microsystems Engineering: Metrology and Inspection III (eom02) Best regards, C. Gorecki Conference chair ********* Microsystems Engineering: Metrology and Inspection III (eom02) Part of SPIE's International Symposium on Optics and Lasers in Metrology 23-26 June 2003, ICM-International Congress Ctr., Munich, Germany Conference Chair: Christophe Gorecki, Univ. de Franche-Comté (France) Cochair: Anand K. Asundi, Nanyang Technological Univ. (Singapore) Micro-electro-mechanical systems (MEMS) and micro-opto-electro-mechanical systems (MOEMS) is a rapidly growing technology envisioned to gather and process information, compute, and control an environment or a macrosystem through actuators and sensors increasing the affordability, functionality, and performance of smart systems. The objective of this third conference in a series is to provide a forum to present and discuss the recent advances in characterization, testing and reliability of MEMS/MOEMS devices and systems. The conference will be focused on applications of appropriate optical measuring techniques and related techniques in the following situations: -local analysis of material constants -strain and stress properties -local analysis of cracks -contact problems, -fracture and fatigue -aging of devices and materials -life cycle predictability of materials -thermal aspects and effects of radiation - characterisation of micro-actuation mechanisms -vibration analysis -failure modes -reliability and long term stability -environmental testing -packaging and integration or/and interface to macro-world -predictions of life of packaged devices -related applications.Abstract Due Date: 25 November 2002 Manuscript Due Date: 26 May 2003 **************Submission procedure 1. SUBMIT TO: EOM02, GORECKI 2. SUBMIT EACH ABSTRACT TO Microsystems Engineering: Metrology and Inspection III (eom02) 3. ABSTRACT TITLE 4. AUTHOR LISTING (principal author first) AFFILIATION/ADDRESS 5. PRESENTATION : oral or poster 6. BRIEF BIOGRAPHY ( principal/presenting author) 7. ABSTRACT TEXT Approximately 250 words. 8. KEYWORDS Submission on the web : www.spie.org/info/eom/ www.spie.org/info/eom/ www.spie.org/info/eom/ www.spie.org/info/eom/ E-MAIL submission to: abstracts@spie.org in ASCII text MAIL submission :: OPTICS AND LASERS IN METROLOGY SPIE, P.O. Box 10, Bellingham, WA 98227-0010 USA Shipping Address: 1000 20th St., Bellingham, WA 98225 USA FAX : one copy to SPIE at 360/647-1445 (send each abstract separately). ******************************************************************* Dr. Christophe Gorecki, CNRS Senior Researcher Laboratoire d'Optique P.M. Duffieux, Faculte des Sciences et Techniques 16 route de Gray, 25030 Besancon, France Tel: +33-3-81666607, fax: +33-3-81666423 e-mail: christophe.gorecki@univ-fcomte.fr