Hi

I am trying to bond glass-glass wafers (and glass-silicon wafers) where Ti/Au
layers were deposited and patterned. They are cut into pieces (30 mm by 30 mm)
to be wire-bonded (or soldered).  I need to bond these small pieces of wafers
with at least 20~30 um resolution without any optical alignment machines.

I have found making some holes and V-shaped grooves to bond and align without
any aligner machines. However, I am not sure whether they will work for glass
wafers.

Please, let me know if there are any ways that I can do the bonding without
alignment-bonding machines.

Thank you.