Wow, that's a lot of questions. I'll start it out by answering what I can.

On Mon, 21 Oct 2002, Sampo Tuukkanen wrote:

> Hi,
>
> Can I use PMMA as a resist when I'm etching e-beam evaporated SiO2 layer
> above the Au-layer?

No idea.

> Does HF etch Au or Ti?

HF etches Ti quite quickly. Cr makes a more HF-resistant adhesion layer.
However, Cr has a higher residual stress (in e-beam evaporation). Au
appears to be HF resistant.

> Can I use pure dilute HF or does it have to be buffered with HN3F for some
> reason?

I know people who use HF diluted with DI water. It works well for them. I
just prefer messing with HF as little as possible, so I use BOE "off the
shelf."

>
> How can I wet-etch Au slowly (~100 nm/min)?

I would guess that diluted aqua regia would etch Au more slowly than the
pure stuff.

> Can I etch Au with RIE and with what resist?

I've heard that Au can be etched with Cl RIE, but don't quote me on that.
I'm pretty sure it won't etch in SF6 or CF4, though.

>
> Thanks already,
>
> Sampo Tuukkanen, nanoelectronics Group, University of Jyväskylä, Finland
>

Hope this helps.

Jesse Fowler
  UCLA/MAE Dept., 420 Westwood Plaza, Room 37-129, ENGR IV
  Los Angeles, CA 90095-1597 | (310)825-3977
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