Hi Xing,

I have done tests on Cr/Pd/Au and Cr/Pt/Au layers, typically in the range of
15/50/300 nm thickness. Test that were done include anneal tests up to
400oC. Pd proofs to be a somewhat better anti-diffusion layer then Pt (based
on color changes and sqaure resistance measurements) but both seem to work
fine. A problem with Pd is that is has much more stress then a Pt layer. I
also considered Ni, but never tried it myself (the problem was availability
at that time, no functional reason).

Niels Olij

>-----Original Message-----
>From: Neal Ricks [mailto:micromach@yahoo.com]
>Sent: Wednesday, October 23, 2002 16:57
>To: mems-talk@memsnet.org
>Subject: Re: [mems-talk] Diffusion barrier for Cr/Au or Ti/Au
>
>
>
>You may want to evaluate Nickel as well.
> Xing Yang  wrote:
>In Au metalization process, the common adhesion layer Cr or Ti
>tends to diffuse through the Au layer, especially at high
>temperatures. A quick Google search shows that Pt or Pd has
>been commonly used as the diffusion barrier layer. I wonder if
>anyone has done any experiments or know any published papers
>on this topic. I am looking for information on what the diffusion
>barrier layers and their thicknesses have been tried and how
>effective they are.
>
>Any info will be appreciated.
>
>Xing Yang
>
>
>
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