Hello,

I'm encountering problems with adhesion of PECVD SiN and SiO2 to
electroplated gold. I hardly can allow an Ti or Cr adhesion layer
since I have to remove the seed layer before the plasma deposition.
O2 treatment of the gold before the CVD doesn't seem to help either.
Does anybody have other hints? Etching of the gold to roughen the
surface? I'm grateful for any advice.

Regards,
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Joachim Oberhammer, Dipl.-Ing.

Royal Institute of Technology (KTH)   Phone:    +46/(0)8 790 6250
Dept. of Signals, Sensors and Systems Fax:      +46/(0)8 10 0858
Microsystem Technology (MST)          Mobile:   +46/(0)70 692 1858
                                       e-mail:   joachim.oberhammer@s3.kth.se
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SE-100 44 Stockholm, Sweden