Here's another removal method:
Heating the cyanoacrylate on a hot plate to above about 200 C
decomposes it so that the wafers can be separated.
The powdery residue can then be wiped off with acetone.

        --Kirt Williams Agilent Technologies

> -----Original Message-----
> From: Michael D Martin [mailto:michael.martin@louisville.edu]
> Sent: Tuesday, November 05, 2002 12:03 PM
> To: mems-talk@memsnet.org
> Subject: Re: [mems-talk] Bonding material impervious to KOH bath
>
>
> Try Super Glue, aka cyanoacrylate. It works well in TMAH and EDP.  It
> can be dissolved it in acetone, though I've been bonding the front of
> wafers to chrome coated glass and then etching the chrome to release.
>
> Good luck,
>    mike
>
>
> >>> skk9@cornell.edu 11/02/02 10:32AM >>>
> Are there materials that can used for wafer bonding
> that doesn't get etched/stripped in KOH bath? I've
> already tried Apiezon black wax, crystal bond, SU-8
> (not fully crossed), but they all seems to not work
> quite well. I would appreciate any advice.
> Thanks,
> Kevin
>
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