durusmail: mems-talk: 3d chip integration (packaging), interconnection and housing in one step
Shadow Mask
3d chip integration (packaging), interconnection and housing in one step
3d chip integration (packaging), interconnection and housing in one step
Andrea Reinhardt
2002-11-22
To everybody interested in using this new technology (3D-CSP) which will not
require any classical bonding and offers more possibilities in making the
components as small as possible, we will send a PowerPoint presentation for free
(in print or on cd), please just forward your mail address

Regards
Andrea

----- Original Message -----
  From: Richard Morrison
  To: mems-talk@memsnet.org
  Sent: Friday, November 22, 2002 6:15 PM
  Subject: [mems-talk] Shadow Mask


  Call  Photo Sciences they have made Shadow mask they are excellent, Tel#
310-784-7460

  Rick

  Rick Morrison
  Sr. Semiconductor Engineer
  Radant Mems Inc.
  255 Hudson Road
  Stow Ma, 01775
  Tel- 978-562-3866
  Cell 508-801-4796
  AMS Phone: 508-770-3521
  EMAIL  rmorrison@radanttechnologies.com

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