Hello MEMS Enthusiasts,

we are currently dealing with the well known problem of bonding by Al wire a
Au pad of an chip included in an MEMs like submount.

The generation of "purple plague" at the interface of Al and Au will be a
major obstacle for reliability.

Are there any clever solutions for add-ons, which prevent this "corrosion"?
I've not checked the literature in depth and I would like to ask for hints.

Thanks in advance.

Manfred Korn

> ************************************************
> Manfred Korn          :-)=
> Alcatel SEL AG, Dept. ZFZ/OP
> Lorenzstr. 10, D-70435 Stuttgart
> Phone         +49-(0)711-821.45303
> Fax.          +49-(0)711-821.46355
> E-Mail        mailto:manfred.korn@alcatel.de
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