Scribing is also an option - it's a completely dry die separation process.
There are companies that sell very complete systems.

David Nemeth
Senior Process Engineer
Sophia Wireless, Inc.
14225-C Sullyfield Circle
Chantilly, VA
Ph: (703) 961-9573 x206
Fax:(703) 961-9576

-----Original Message-----
From: mems-talk-admin@memsnet.org [mailto:mems-talk-admin@memsnet.org]On
Behalf Of Jeff Hibner
Sent: Friday, November 22, 2002 10:45 AM
To: mems-talk@memsnet.org
Subject: [mems-talk] MEMS Dicing question


We have developed a MEMS based microphone that will be used in the cell
phone industry.  One of the problems we have run into is in the dicing
process.  The membranes on the chip are very fragile and can very easily
damaged.  We can't use tape directly on the chips and water would hurt
them.  We are experimenting with using two layers of tape with the first
layer having holes punched out where the membranes will be and the
second layer forms a tent over them.  With this process the membranes
will never touch the tape.
If there is anyway your company could help us we'd appreciate any ideas
and would enjoy working with you.

Thank you,

Jeff Hibner
Akustica Inc.
2403 Sidney Street
Pittsburgh PA 15203
Phone 412-390-1730
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