Hi Jeff, Here's a comment: By 1975, production fabs were using plasma etchers (the old barrel type--all that was available at the time) for etching patterned silicon nitride. Hot phosphoric (usually with a reflux lid on it) was used only for stripping the nitride (no resist). There may have been a good reason that "everybody" was using the plasma etchers. It is probably fair to say that etching silicon nitride was the first use of plasma etchers in the production fab. I look forward to responses from other people. Roger Brennan 8710 Gardners School Road Stantonburg, NC 27883 (252) 238-3377 rogerbr@earthlink.net -----Original Message----- From: Jeff Jessing [SMTP:JJessing@boisestate.edu] Sent: Tuesday, December 03, 2002 6:41 PM To: mems-talk@memsnet.org Subject: [mems-talk] Photoresists for Hot Phos. Acid Nitride Etching Hello, Can someone comment on what resists (g-line) are typically used for phosphoric acid etching of silicon nitride? Much thanks. -Jeff _______________________________________________ MEMS-talk@memsnet.org mailing list: to unsubscribe or change your list options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk Hosted by the MEMS Exchange, providers of MEMS processing services. Visit us at http://www.memsnet.org/