For ultrasonic drilling through a glass wafer,
try Sensor Prep Services in Ohio, USA, (630) 365-9645.
They will make a tool with "wires" sticking out at all of the locations you want
holes,
and drill all of them at the same time.

> -----Original Message-----
> From: Anna-Sara Hedman [mailto:Anna-Sara.Hedman@acreo.se]
> Sent: Wednesday, November 27, 2002 6:42 AM
> To: mems-talk@memsnet.org
> Subject: [mems-talk] Through holes (vias) in quartz glass 4 " wafer?
>
>
> Dear Sir/Madam,
>
> Do you know how to make via holes - i.e. holes through
> a quartz glass (fused silica) 4 " wafer, 525 microns thick?
>
> Or do you know anybody else who can do this (in Europe if possible?)
> by laser or ultrasonic drilling? Or any other technique?
>
> I need to have approx. 160 holes in each wafer.
> The wafer is covered with photoresist (or other masking material)
> to mark the location of the through holes,  but also to protect
> the bonding surface on the other side from mechanical scratch ...
> The hole location is quite important...
>
> I'll  be happy to hear from you soon !
>
> Thanks!
>
> Best regards
> 
>
>
>
>
>
>
>
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