Hi everybody,
does anyone have any information on the differences between low-stress
silicon nitride (LSN) and standard silicon nitride (STDN) ?
We know about deposition conditions and residual stress but we are trying
to learn about microstructure and coefficient of thermal expansion. Also,
we are trying to understand crack formation during deposition and anealing.
Is there any data on the maximum thickness that can be deposited ? Has
anybody had any experience with the use of LSN or STDN together with
polysilicon as a structural layer ?
Thanks a lot,

Nelsimar Vandelli
(617)353-9370
Boston University Precision Engineering Research Lab
750 Commonwealth Ave. B12
Boston, MA 02215
(617)353-9370