durusmail: mems-talk: Polyimide with Compressive Residual Stress
Polyimide with Compressive Residual Stress
Polyimide with Compressive Residual Stress
Bill Moffat
2003-01-10
Javeed,
       I need help with your terminology.  What do you define as compressive
residual stress.  We have worked with most of the Polymide manufacturers and
users in producing a Polymide bake oven where the ramp up to bake temperature
can be controlled and the process pressures and gas concentrations are
controlled also.  This produces an almost stress free Polymide film in normal
use.  If you can envisage a process that would induce the stress you are looking
for I could run this test and work with a local company, FSM, to measure the
residual stress.  Let me know if this is a possible solution for you.  Bill
Moffat

-----Original Message-----
From: Javeed Shaikh Mohammed [mailto:jsh021@latech.edu]
Sent: Thursday, January 09, 2003 2:47 PM
To: mems-talk@memsnet.org
Subject: [mems-talk] Polyimide with Compressive Residual Stress


Hello Everyone,
              Does anyone have information on POLYIMIDE (negative or positive,
photodefinable or non, dispense or spin coat type) that can give thicknesses
of sub-0.5 micron range and has a COMPRESSIVE RESIDUAL STRESS. Any help is
appreciated.

Regards,
JSM

--
Javeed Shaikh Mohammed,
BIOMINDS LAB,IFM,
Louisiana Tech University.
Phone: (318) 257-5127
FAX:   (318) 257-5104
MAIL: PO Box 10137,911 Hergot Ave.
      Ruston, LA  71272

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