Hi,
I've recently encountered a problem with released polyimide films
changing their stress characteristics when exposed to acetone. In
particular the film becomes very tensile after a rinse in acetone, this
is causing electrodes on the film to loose continuity since the film
stretches out. I'd like to continue using acetone since it dissolves my
release layer after DRIE. Has anyone run into this problem before?
Thanks,
Mike Martin
>>> BMoffat@yieldengineering.com 01/10/03 08:26AM >>>
Javeed,
I need help with your terminology. What do you define as
compressive residual stress. We have worked with most of the Polymide
manufacturers and users in producing a Polymide bake oven where the ramp
up to bake temperature can be controlled and the process pressures and
gas concentrations are controlled also. This produces an almost stress
free Polymide film in normal use. If you can envisage a process that
would induce the stress you are looking for I could run this test and
work with a local company, FSM, to measure the residual stress. Let me
know if this is a possible solution for you. Bill Moffat
-----Original Message-----
From: Javeed Shaikh Mohammed [mailto:jsh021@latech.edu]
Sent: Thursday, January 09, 2003 2:47 PM
To: mems-talk@memsnet.org
Subject: [mems-talk] Polyimide with Compressive Residual Stress
Hello Everyone,
Does anyone have information on POLYIMIDE (negative or
positive,
photodefinable or non, dispense or spin coat type) that can give
thicknesses
of sub-0.5 micron range and has a COMPRESSIVE RESIDUAL STRESS. Any help
is
appreciated.
Regards,
JSM
--
Javeed Shaikh Mohammed,
BIOMINDS LAB,IFM,
Louisiana Tech University.
Phone: (318) 257-5127
FAX: (318) 257-5104
MAIL: PO Box 10137,911 Hergot Ave.
Ruston, LA 71272
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