> Does anyone have information on POLYIMIDE . . .
> that . . . has a COMPRESSIVE RESIDUAL
> STRESS.

Hmmm. This is a tricky one. Because spin on polyimides contain solvents,
they will generally shrink after bakeout and be in tensile stress.

Many people don't bother to imidize their polyimides. This is a
crosslinking/polymerization process that occurs at higher temperatures, i.e.
> 300°C. I'm not sure what happens to the stress after this process. The
downside to this procedure is that the polyimide becomes very difficult to
remove.

Anyone else know about the details of imidization?

Bill Eaton, Ph.D.
Materials & Analysis Manager
NP Photonics
5706 Corsa Avenue, Suite 100
Westlake Village, CA  91362
Voice:  (818) 991-7044 x211
eFax:   (503) 214-5559
mailto://beaton@npphotonics.com