One option might be to laser dice your chips. Here's a company you might consider: www.jpsalaser.com -Mike >>> nemeth@sophiawireless.com 11/24/02 08:17AM >>> Scribing is also an option - it's a completely dry die separation process. There are companies that sell very complete systems. David Nemeth Senior Process Engineer Sophia Wireless, Inc. 14225-C Sullyfield Circle Chantilly, VA Ph: (703) 961-9573 x206 Fax:(703) 961-9576 -----Original Message----- From: mems-talk-admin@memsnet.org [mailto:mems-talk-admin@memsnet.org]On Behalf Of Jeff Hibner Sent: Friday, November 22, 2002 10:45 AM To: mems-talk@memsnet.org Subject: [mems-talk] MEMS Dicing question We have developed a MEMS based microphone that will be used in the cell phone industry. One of the problems we have run into is in the dicing process. The membranes on the chip are very fragile and can very easily damaged. We can't use tape directly on the chips and water would hurt them. We are experimenting with using two layers of tape with the first layer having holes punched out where the membranes will be and the second layer forms a tent over them. With this process the membranes will never touch the tape. If there is anyway your company could help us we'd appreciate any ideas and would enjoy working with you. Thank you, Jeff Hibner Akustica Inc. 2403 Sidney Street Pittsburgh PA 15203 Phone 412-390-1730 _______________________________________________ MEMS-talk@memsnet.org mailing list: to unsubscribe or change your list options, visit http://www.memsnet.org/mailman/listinfo/mems-talk Hosted by the MEMS Exchange, providers of MEMS processing services. Visit us at http://www.memsnet.org/ _______________________________________________ MEMS-talk@memsnet.org mailing list: to unsubscribe or change your list options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk Hosted by the MEMS Exchange, providers of MEMS processing services. Visit us at http://www.memsnet.org/