We have bonded similar structures at AML previously and would be happy to
run a trial for you.

regards

Tony

Tony Rogers
Applied Microengineering Ltd
173 Curie Avenue
Didcot
OX11 0QG
UK
Tel.: +44 (0)1235 833934
Fax: +44 (0)1235 833935
e-mail: tony@aml.co.uk

Web:http://www.aml.co.uk

-----Original Message-----
From: mems-talk-bounces@memsnet.org
[mailto:mems-talk-bounces@memsnet.org]On Behalf Of A.K.Ismail
Sent: 13 February 2003 09:39
To: mems-talk@memsnet.org
Subject: [mems-talk] Anodic bonding SOI wafer and glass


Hi,

Does anybody has experience of how to bond SOI wafer to glass wafer using
anodic bonding?
Our SOI wafer is about 175-450 micron Si, 1 micron Oxide and 1 micron Si p+.
The interface bonding layer would be the 1 micron Si p+ layer on SOI wafer
with another glass substrate. Your response would be appreciated.

Thank you.

A.K.Ismail



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