Hi, there,

I need to electroplate Cu on the KOH-etched deep trench and side wall. The seed
layer is Cr/Cu by sputtering and photoresist is the protective mask. Does anyone
know how to set up the electroplating parameters such as solution, current,
temperature, etc. ?

Thanks,

Swiss









---------------------------------
Do you Yahoo!?
Yahoo! Platinum - Watch CBS' NCAA March Madness, live on your desktop!