I want to Cu plate small pillar/buttons, about 50um X 50um, onto Al on a
simulated CMOS chip.
The idea is to test plate onto an Al coated SiO2/Si wafer, with an oxide
mask to define the plating area.
The problem is/will be getting good adhesion and electrical conductivity
between the Cu and Al. The Al surface will need to be clean/deoxidized to
achieve this. Commercial processes for doing this look rather agressive and
include some unfortunate chemicals.
Has anybody done this? and how did they prepare the Al surface without
compromising any CMOS (which is protected by an oxide/Al/oxide film)
or
does anyone have any ideas?

Thanks

Alan W


Dr Alan Wilson
Defence Science and Technology Organization, Australia
               on attachment to the
       Center for Integrated Systems, Room 206X,
   Stanford University, Stanford CA 94305-4075, USA.

E'mail: alan@sensors.stanford.edu  (alan.wilson@dsto.defence.gov.au)

Tel (+1 415) 725 1682  Fax (+1 415) 725 9020