Swiss,
    Plating Cu is easy but plating Cu well ( in that I mean for your spec.
thick, thin, fast, slow, stress, no stress, xtal growth x, xtal growth y,
etc., etc., etc. ) is something that can't be explained in one email. If
your trying to get started and don't care about these things
50g/l   Cu2So4*5H20; Copper sulfate       aldrich, sigma etc.
50g/l   H2So4;               Sulfuric                         same
50ppm Cl
room temp will work, DC will work, current densities in the 10-100ASF range
are normal; with this set up I'd stay below 40ASF,
there are tons of additives AlK(SO4)2  grain refiner 2g/l is one, with
respect to a copper seed layer make it thick enough but if you can't and
have to go thin ~1000A Cu make sure the contact resistance of your clip is
low and go in with the power supply (P.S.) ON or what I call "hot", I use a
pulse P.S. and when using a Cu seed I go DC & hot first then switch to
pulse. As for anodes a Cu anode will do (soluble), oxygen free copper OFC is
nice. A TiPt mesh anode (insoluble) will work too ( I know Technic can
provide this for you ). Titration will allow you to keep the bath in spec.
or for a small fee you can send it out for analysis (again Technic and
Enthone can do this for you ). Eventually filtering will become important
and solution flow is good too, a paddle arm will work before you get into
using a filter pump. Technic, Enthone and Shipley have there copper plating
chemistries but sometimes/initially the above mixture will work just as
well. I know there's alot here but give it a shot and soon you'll be on your
way to things like Hull Cell, Stress/Strip test, current robber, anode
shield, throwing power etc. etc. etc.

eric


> Hi, there,
>
> I need to electroplate Cu on the KOH-etched deep trench and side wall. The
seed layer is Cr/Cu by sputtering and photoresist is the protective mask.
Does anyone know how to set up the electroplating parameters such as
solution, current, temperature, etc. ?
>
> Thanks,
>
> Swiss