Does anybody know how to "cleave" ultra thin Si wafers?
I need to cut, from ultra-thin (30 microns) Si wafers, substrates of ~
10 x 20 mm. I tried to use different kind of diamonds, but I always have
the same problem: the substrate is not more "flexible", if I try to bent
it, it cracks in many parts. I suspect that I am generating defects
during the cutting of the substrates that propagate during the bending.
Any suggestion?.
Thanks for the reply to my e-mail: broitman@andrew.cmu.edu
E. Broitman
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Dr. Esteban Broitman
Senior Research Associate
Department of Chemical Engineering
Carnegie Mellon University
Pittsburgh,  PA 15213
Phone: (412) 268-9537
FAX: (412) 268-7139
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