I don't know if you have it available, but I would try to use  deep
Si etch.  30 um is not too much, and I would hope you can do this with thick
photoresist, and thin wafer glued with same photoresist on top of the
carrier wafer..


> Esteban Broitman wrote:
> > Does anybody know how to "cleave" ultra thin Si wafers?
> > I need to cut, from ultra-thin (30 microns) Si wafers, substrates of ~
> > 10 x 20 mm. I tried to use different kind of diamonds, but I always have
> > the same problem: the substrate is not more "flexible", if I try to bent
> > it, it cracks in many parts. I suspect that I am generating defects
> > during the cutting of the substrates that propagate during the bending.
> > Any suggestion?.
> > Thanks for the reply to my e-mail: broitman@andrew.cmu.edu
> > E. Broitman
> > ----------------------------------
> > Dr. Esteban Broitman
> > Senior Research Associate
> > Department of Chemical Engineering
> > Carnegie Mellon University
> > Pittsburgh,  PA 15213
> > Phone: (412) 268-9537
> > FAX: (412) 268-7139
>
> Kmbh Associates
> 47 Rocket Circle
> Rancho Cordova, CA 95742  U  S  A
> 510-714-5055 Efax- 510 217 4421 or 561 658 6136
>
> High Purity Float Zone and Specialty CZ Silicon  for Power, IR and
> Mirror Optics, Optoelectronics, MEMS, SOI, and other Semiconductor
> applications. Service in SOI, Polishing SSP and DSP.
> Quartz, Glass, Pyrex and Borofloat Wafer Supply. Anodic Bonding. SOG, SOS.
>
>
>
> _______________________________________________
> MEMS-talk@memsnet.org mailing list: to unsubscribe or change your list
> options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk
> Hosted by the MEMS Exchange, providers of MEMS processing services.
> Visit us at http://www.memsnet.org/