durusmail
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mems-talk
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ask for the parameters of RIE for SiO2,Si and Si3N4 (ÂÞÔª)
TEOS dep foundry (Kenneth Smith)
Pad etch (Roger Shile)
Surplus SOI/prime wafers for sale (Larissa Schwartz)
Ask reference on "wafer bonding with Au thermocompression" (HAN,CHEOL-HYUN (A-SanJose,ex1))