durusmail
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mems-talk
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Polymber molding (Yanjun(David) Tang)
adhesion of PECVD SiN or SiO2 to electroplated gold (Oberhammer Joachim)
Electron beam lithography with a filament SEM (Francois MONTAIGNE)
1 micron thick low stress nitrides? (Mighty Platypus)
measuring thickness of thin organic layers (Madanagopal K.V.)
1 micron thick low stress nitrides? (bille@npphotonics (Bill Eaton))
1 micron thick low stress nitrides? (kirt_williams@agilent.com)
3-dimensional diffusion model (Qintao Zhang)
some doubts about MEMS (Cesare)
3-dimensional diffusion model (Josef Kouba)
1 micron thick low stress nitrides? (Michael D Martin)
1 micron thick low stress nitrides? (kirt_williams@agilent.com)
Coating Vendors (Michael D Martin)
some doubts about MEMS (Summers, Jeff)
Bonding material impervious to KOH bath (Michael D Martin)
Bonding material impervious to KOH bath (David Nemeth)
MUMPs Modeling Software (Robert Johnstone)
1 micron thick low stress nitrides? (kirt_williams@agilent.com)
Bonding material impervious to KOH bath (kirt_williams@agilent.com)