durusmail
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mems-talk
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PDMS to metal bond and corona discharge (Michael D Martin)
Ansys Initial stress problem (rakesh babu)
working without clean room (Patrick Roman)
how to bond silicon wafer to stainless steel? (Brubaker Chad)
Pyrex CTE at 500C (Paul Elliott)
Etching copper in ferric chloride (Leidong Mao)
Oxide Release - Etch Holes (Kishore Sundara-Rajan)
Etching copper in ferric chloride (Jauniskis, Linas)
Oxide Release - Etch Holes (Phillipe Tabada)