durusmail
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mems-talk
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Through Hole etching of evry deep holes - Aspect ratio - 25-30 (Pradeep Dixit)
details on microfluidics (vishwanath sai)
help on tungsten / tungsten silicide selective etch (Jialin Zhao)
Problem with airbubbles on PDMS-surface in water (sebastian.grosse@post.rwth-aachen.de)
details on microfluidics (FRANK BOEHM)
details on microfluidics (wahid YEMI.)
Problem with airbubbles on PDMS-surface in water (ajheim@mail.usf.edu)
literature to on newtonian fluids near surfaces (Marc Hennemeyer)
Through Hole etching of evry deep holes - Aspect ratio - 25-30 (Shane Arthur McColman)
Through Hole etching of evry deep holes - Aspect ratio- 25-30 (walter@elume.com)
About the RIE etch of SiO2 (Joe Lonjin)