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mems-talk
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Etching 200 nm into a Saphirre Wafer (Kirt Williams)
make the su-8 surface flat (Gareth Jenkins)
residual stress vs. thin film thickness (Andrea Mazzolari)
aluminum etchant vs. copper vs. aluminum (Ned Flanders)
aluminum etchant vs. copper vs. aluminum (Shay)
make the su-8 surface flat (Shane GUO)
aluminum etchant vs. copper vs. aluminum (Kirt Williams)
Etching 200 nm into a Saphirre Wafer (Gary Hillman)